The Next Generation of IEEE 802 Networking Standards
The technical standards created by the IEEE 802 Local Area Networking/Metropolitan Area Network Standards Committee (LMSC) over the past 40 years have been essential in enabling suppliers of data communications components, products, systems, and services to be delivered economically at an immense scale. Join IEEE Educational Activities as we begin this series looking at what the future holds for new IEEE 802 standards.
This event is sponsored by: Cetecom
This webinar is ideal for professionals, researchers, and engineers in networking.
Instructors:
James Gilb
Dr. James P. K. Gilb has 28 years experience in a variety of areas including; radarabsorbing materials, RFIC, RF system specification and architecture development, and MAC protocols. He joined General Atomics Aeronautical Systems, Inc., in 2016 as a Principal RF Systems Engineer.
He has been a contributor to international communications standards for 21 years, primarily in IEEE 802. IEEE 802 is responsible for the development of many technically relevant, widely implemented standards. He has held a variety of leadership positions in IEEE 802 and is currently the IEEE 802 LMSC Executive Committee First Vice Chair and the IEEE 802.15 Working Group Technical Editor.
He has 9 issued patents, been the technical editor of 9 standards and specifications, written 3 books, and has many papers in refereed journals and at symposia.
Paul Nikolich
Paul Nikolich develops new technologies, technical standards, intellectual property and ventures in data communications and broadband industries as an angel investor and board member of companies in their early stages of development.
He is an IEEE Fellow and Chairman of the IEEE 802 LAN/MAN Standards Committee overseeing technical standards development for wired (e.g., Ethernet) and wireless (e.g., Wi-Fi) networking applications since 2001.
Mr. Nikolich is a Partner in YAS Broadband Ventures LLC, holds several patents and has a BS in Electrical Engineering, a BS in Biology and a M.S. in Biomedical Engineering from Polytechnic University in Brooklyn, N.Y.
Publication Year: 2021
ISBN: 978-1-964935-57-7