Automotive Sensor Packaging Trends
An increasing number of sensors are used in automotive applications. Familiar sensors applications include air bags and tire pressure sensors. New automotive safety features include improved self-diagnostics, crash avoidance technology, and advanced driver assistance. This translates into increase use of image sensors, LiDAR, and radar. Multiple combinations of sensors are anticipated. What types of semiconductor packages are used in these automotive electronics and what are the future challenges as new package types are adopted? This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.
Instructor
Jan Vardaman
Jan Vadarman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT (now EPS) and is an IEEE CPMT (EPS) Distinguished Lecturer. She is a member of SEMI, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Publication Year: 2017
Earn 1 Professional Development Hour (PDH) for completing the webinar (form completion required)